SEMICONDUCTOR PACKAGE HAVING ANTIOXIDANT COPPER WIRE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package having an antioxidant copper wire.

SOLUTION: In the semiconductor package wherein a semiconductor chip pad is connected to a terminal by a wire, the wire is a copper wire coated with an antioxidant film. According to this method, the copper wire provides excellent electrical characteristics and reliability while maintaining the same merit compared with a gold wire.

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