| 摘要 |
PROBLEM TO BE SOLVED: To prevent a defective article from being handled as a normal article due to a marking error in acceptance/rejection marking at the electrical characteristic inspection of an IC chip on a wafer. SOLUTION: In a method, the electrical inspection of the IC chips formed on the wafer is performed and the IC chip determined as the normal article is marked at a predetermined place where it does not cause an operational failure. COPYRIGHT: (C)2003,JPO
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