| 摘要 |
PROBLEM TO BE SOLVED: To provide a package type semiconductor device having excellent heat sink characteristics without impairing electrical characteristics in a high frequency, efficient package design at mounting or the like and a low manufacturing cost. SOLUTION: The package type semiconductor device comprises a deformable insulating flexible film 1, first and second conductor layers 2, 3 formed on both surfaces of the film 1 for constituting a wiring pattern, an LSI 4 mounted on the layer 1, a conductor for connecting the pattern formed on the film 1 formed in a hole 9 formed in the film to a wiring pattern formed on the layer 2, a stiffener 6, and a heat spreader 7. Part of the patterns formed of the layers 2, 3 is wiring for a high speed signal and of which the characteristic impedance is calculated, and a connector to the board 20 is formed at the end of the wiring. COPYRIGHT: (C)2003,JPO |
