发明名称 |
Sensor head apparatus |
摘要 |
A sensor head apparatus is configured to include a plurality of sensor ports each configured to receive and electrically interconnect with a sensor head component. The sensor head is further configured to be connectable to a housing for a multi-parameter monitoring tool assembly, wherein electrical connections are provided between the electronics for the tool assembly and any sensor head component engaged in the sensor head. Each port in the sensor head is configured to receive and engage a sensor head component through application of a linear force on the component.
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申请公布号 |
US2003177851(A1) |
申请公布日期 |
2003.09.25 |
申请号 |
US20020072020 |
申请日期 |
2002.02.06 |
申请人 |
HENRY KENT D.;WATSON MARK A.;ONKEN-SHAW SHANEN |
发明人 |
HENRY KENT D.;WATSON MARK A.;ONKEN-SHAW SHANEN |
分类号 |
G01D11/24;G01D21/02;G01N33/18;(IPC1-7):G01D21/00 |
主分类号 |
G01D11/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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