发明名称 Semiconductor device and method of manufacturing same
摘要 A method of manufacturing a semiconductor device include a step of forming an insulating layer, which is obtained by building up a first oxide film, a nitride film and a second oxide film on a substrate in the order mentioned, and a Salicide step of forming a Salicide-structure gate electrode on the insulating film. A silicidation reaction between the substrate surface and an N+ diffusion region is prevented in the Salicide step by causing the insulating layer to remain even in a region on the substrate besides that immediately underlying the gate electrode.
申请公布号 US2003178675(A1) 申请公布日期 2003.09.25
申请号 US20030387369 申请日期 2003.03.12
申请人 NISHIZAKA TEIICHIRO;JINBO TOSHIKATSU;KOHNO TAKAKI 发明人 NISHIZAKA TEIICHIRO;JINBO TOSHIKATSU;KOHNO TAKAKI
分类号 H01L21/8247;G11C16/04;H01L21/336;H01L21/8234;H01L21/8246;H01L27/088;H01L27/10;H01L27/105;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L29/76 主分类号 H01L21/8247
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