| 摘要 |
<p>A method for producing an organic thin-film device comprising the steps of (a) heating and/or pressing a transfer material having an organic thin-film layer formed on a temporary support and a first laminate comprising a substrate and at least a transparent conductive layer or a rear-surface electrode formed on the substrate, which are overlapped each other such that the organic thin-film layer of the transfer material faces a receiving surface of the first laminate, thereby forming a laminate structure; (b) peeling the temporary support from the laminate structure to transfer the organic thin-film layer to the receiving surface of the first laminate; and (c) bonding a second laminate comprising a substrate and at least a rear-surface electrode or a transparent conductive layer formed on the substrate to the organic thin-film layer transferred onto the first laminate.</p> |
