| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum processing apparatus wherein an erected substrate is processed, further a multi-layer film is formed in the same vacuum vessel. SOLUTION: Since a substrate is erected upright by a substrate erecting device 31 so that substrate surfaces are arranged parallel and counterposed respectively to cathodes 82 and 81 while in first and second upright attitudes, so that with a substrate holder 32 in the first upright position, an Al target provided at one cathode 81 is sputtered to the substrate surface for film-forming an Al film, and then with the substrate holder 32 in the second upright position, the other cathode 82 is sputtered to the substrate surface for film-forming a Ti film on the substrate surface. Thus in a single vacuum vessel 11, a two-layer film of Ti and Al is film-formed on the substrate surface. So, the space occupied by a film-forming chamber is reduced by that amount, for improved throughput. |
