| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost electromagnetic interference(EMI) shield which can be added to a product without requiring large design change of the product. SOLUTION: An inexpensive EMI shield, which engages with the periphery of an integrated circuit package and absorbs electromagnetic energy and radiates it as heat, is provided. This shield is not of ohm conductivity, and accordingly this can make contact with the conductor electrically in activity without affecting the action of a circuit. For EMI the periphery of the material 202 which incurs loss to a high frequency magnetic current prevents radiation from the integrated circuit package. This periphery is engaged around the integrated circuit package so that the gap between the upper conductor of a heat sink or others and a printed circuit board so as to be blocked completely by loss materials. The position of the loss material can be fixed by a frictional fitting piece incorporated in the loss material, an adhesive, or automatic lock or a retention structure. |
