| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor, which has excellent flame retardance, solder-resistant reflow property and moldability and is friendly to the environment and in which a halogen-based flame retardant and an antimony compound are hardly used. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises (A) an epoxy resin, (B) a phenol resin, (C) a curing promoter, (D) one or more kinds of flame retardants composed of a metal hydroxide solid solution consisting of a metal such as Ni, Zn, etc., and/or a metal hydroxide and (E) an inorganic filler except the metal hydroxide solid solution and the metal hydroxide as essential components. The epoxy resin and the phenol resin have structures represented by the general formula (Rs and Xs are each hydrogen or a 1-4C alkyl group, may mutually be the same or different and at least one or more Xs contain groups except H; a is an integer of 0-3; b is an integer of 0-4; n is the average value of a positive number of 1-10; Y is hydrogen or a glycidyl group). COPYRIGHT: (C)2003,JPO
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