发明名称 |
Method for scalable architectures in stackable three-dimentsional integrated circuits and electronics |
摘要 |
The design methods described enable three-dimensional integrated circuit systems in which all of the dies, in a vertically bonded stack of dies, are identical. Only one mask set and wafer type is required since a single circuit design is produced for one die in the stack and reused for all the dies with little or no modification. The system scales directly as the level of stacking is increased while incurring no extra design effort, beyond that required for the initial design.
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申请公布号 |
US2003178228(A1) |
申请公布日期 |
2003.09.25 |
申请号 |
US20030391781 |
申请日期 |
2003.03.20 |
申请人 |
SUNG RAYMOND JIT-HUNG;BRANDON TYLER LEE;KOOB JOHN CONRAD;ELLIOTT DUNCAN GEORGE;LEDER DANIEL ARIE |
发明人 |
SUNG RAYMOND JIT-HUNG;BRANDON TYLER LEE;KOOB JOHN CONRAD;ELLIOTT DUNCAN GEORGE;LEDER DANIEL ARIE |
分类号 |
H01L25/065;H05K1/11;H05K3/46;(IPC1-7):H05K1/02 |
主分类号 |
H01L25/065 |
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