Substrate processing apparatus and substrate cleaning method

摘要

A substrate processing apparatus is provided with an IPA spouting nozzle in opposition to an objective surface of a substrate supported by a support part. A nozzle swinging mechanism swingably supports the IPA spouting nozzle through an arm. An IPA supply pipe and a nitrogen gas supply pipe are connected to the IPA spouting nozzle. IPA and nitrogen gas supplied from these supply pipes are mixed with each other in the IPA spouting nozzle for forming IPA droplets. The formed IPA droplets are spouted toward the objective surface of the substrate. Consequently, the objective surface of the substrate can be cleaned with IPA. Thus provided is the substrate processing apparatus cleaning the substrate hard to clean with deionized water.