| 发明名称 |
METHOD FOR HERMETICALLY ENCAPSULATING A COMPONENT |
| 摘要 |
The invention relates to a method for hermetically encapsulating a component (1) that is mounted in flip-chip design on a support (4). The inventive method is characterized by first covering the component with a film (8) that closely rests on the component and the support, then structuring the film, and providing thereon a hermetically sealing layer (14), especially a metal layer, which seals up with the support. |
| 申请公布号 |
WO03012856(A3) |
申请公布日期 |
2003.09.25 |
| 申请号 |
WO2002DE02188 |
申请日期 |
2002.06.14 |
| 申请人 |
EPCOS AG;STELZL, ALOIS;KRUEGER, HANS;FEIERTAG, GREGOR;CHRISTL, ERNST |
发明人 |
STELZL, ALOIS;KRUEGER, HANS;FEIERTAG, GREGOR;CHRISTL, ERNST |
| 分类号 |
H01L23/28;H01L21/50;H01L21/56;H01L21/60;H01L23/10;H01L23/552 |
主分类号 |
H01L23/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
