发明名称 ANISOTROPICALLY ELECTROCONDUCTIVE ADHESIVE AND HEAT- SEAL CONNECTOR
摘要 PROBLEM TO BE SOLVED: To provide an anisotropically electroconductive adhesive which is enhanced in preservation performances at ordinary temperature, permits stable connection free from fluctuation in connection resistance and exhibits excellent repairing performances, and a heat-seal connector. SOLUTION: The anisotropically electroconductive adhesive comprises an electroconductive particle 2, obtained by metal-coating 13 a resin particle 12 obtained by microcapsulating a reactive resin 10, a curing agent 4 for the reactive resin 10 in the adhesive composition 3, and a thermoplastic resin 5. The electroconductive particle is destroyed by heating and pressurization thereby permitting the reactive resin to react with the curing agent by a rise in temperature to cause curing. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003268344(A) 申请公布日期 2003.09.25
申请号 JP20020078755 申请日期 2002.03.20
申请人 SHIN ETSU POLYMER CO LTD 发明人 EGAWA TOSHIHIKO
分类号 C09J201/00;C09J9/02;C09J11/08;H01B1/00;H01B1/22;H01R11/01;(IPC1-7):C09J201/00 主分类号 C09J201/00
代理机构 代理人
主权项
地址