| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material having high fluidity even with a high content of inorganic fillers and high packaging reliability after sealing and molding of semiconductors, and a semiconductor device using it. SOLUTION: The material comprises an epoxy resin, a hardening agent, a hardening accelerator and inorganic fillers, and the device is composed of the material. The fillers have an average particle size of 15-25μm and comprise (a) spherical silica of an average particle size of 30-50μ, (b) spherical silica of an average particle size of 0.3-1.0μand (c) spherical silica of an average particle size of 0.1-0.05μm in a weight ratio (d) of (c)/(a+b+c) of 0.005-0.1, a weight ratio (e) of (b)/(a+b) of 0.001-0.1 and a combined content of (a+b+c) of 90 wt.% or more, based on the total content of the fillers. COPYRIGHT: (C)2003,JPO
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