| 摘要 |
A semiconductor device manufacturing method according to the present invention comprising: arranging a dam made of a highly heat-shrinkable material on a surface of a circuit substrate, wherein the dam defines a region including a semiconductor element, a conductor, and part of a conductive pattern connected to one end of the conductor; injecting a sealer into a region defined by the dam and using the sealer to seal the semiconductor element, the conductor, and part of the conductive pattern connecting with one end of the conductor; and cooling the dam to remove it. Namely, the method can decrease costs, shorten the manufacturing time, and provide miniaturized COB-mounted semiconductor devices.
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