| 发明名称 |
Smooth pads for CMP and polishing substrates |
| 摘要 |
Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance.
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| 申请公布号 |
US2003181155(A1) |
申请公布日期 |
2003.09.25 |
| 申请号 |
US20030397069 |
申请日期 |
2003.03.24 |
| 申请人 |
WEST THOMAS E.;WU GUANGWEI;DIETZ DONALD P. |
发明人 |
WEST THOMAS E.;WU GUANGWEI;DIETZ DONALD P. |
| 分类号 |
B24B37/04;B24B53/007;B24B53/017;B24B53/12;B24D3/32;B24D13/14;(IPC1-7):B24D11/00 |
主分类号 |
B24B37/04 |
| 代理机构 |
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