发明名称 COVER TAPE FOR CONVEYING ELECTRONIC PART, MANUFACTURING METHOD THEREFOR AND ELECTRONIC PART CONVEYING BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide a cover tape for conveying electronic parts, having a good peeling off property and adequate adhesiveness, capable of preventing peeling electrification at the time of peeling off of the cover tape. <P>SOLUTION: The cove tape for conveying the electronic parts is the one in which a heat adhesive resin layer is provided on a support and an antistatic layer is provided on an outer side of the support or between the support and the heat adhesive resin layer. It is characterized in that a contact angle against water is 0.5-95&deg; and a surface resistivity is 1.0&times;10<SP>13</SP>&Omega;/square or less on a surface of the heat adhesive resin layer. A critical surface tension &gamma;c on the surface of the heat adhesive resin layer may be 2.6&times;10<SP>-4</SP>-7.0&times;10<SP>-4</SP>N/cm. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003266016(A) 申请公布日期 2003.09.24
申请号 JP20020369153 申请日期 2002.12.20
申请人 NITTO DENKO CORP 发明人 ICHIKAWA HIROKI;NAKANO ICHIRO;KAKIMOTO WATARU;TANI ATSUSHI
分类号 B65D77/02;B05D7/04;B05D7/24;B32B7/02;H05K13/02 主分类号 B65D77/02
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