发明名称 |
COVER TAPE FOR CONVEYING ELECTRONIC PART, MANUFACTURING METHOD THEREFOR AND ELECTRONIC PART CONVEYING BODY |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cover tape for conveying electronic parts, having a good peeling off property and adequate adhesiveness, capable of preventing peeling electrification at the time of peeling off of the cover tape. <P>SOLUTION: The cove tape for conveying the electronic parts is the one in which a heat adhesive resin layer is provided on a support and an antistatic layer is provided on an outer side of the support or between the support and the heat adhesive resin layer. It is characterized in that a contact angle against water is 0.5-95° and a surface resistivity is 1.0×10<SP>13</SP>Ω/square or less on a surface of the heat adhesive resin layer. A critical surface tension γc on the surface of the heat adhesive resin layer may be 2.6×10<SP>-4</SP>-7.0×10<SP>-4</SP>N/cm. <P>COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003266016(A) |
申请公布日期 |
2003.09.24 |
申请号 |
JP20020369153 |
申请日期 |
2002.12.20 |
申请人 |
NITTO DENKO CORP |
发明人 |
ICHIKAWA HIROKI;NAKANO ICHIRO;KAKIMOTO WATARU;TANI ATSUSHI |
分类号 |
B65D77/02;B05D7/04;B05D7/24;B32B7/02;H05K13/02 |
主分类号 |
B65D77/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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