Method for processing a semiconductor wafer and laminate substrate used as a support for said semiconductor wafer in said method,申请号EP20020025405-传众专利搜索

发明名称	Method for processing a semiconductor wafer and laminate substrate used as a support for said semiconductor wafer in said method
摘要
申请公布号	EP1316992(A3)	申请公布日期	2003.09.24
申请号	EP20020025405	申请日期	2002.11.14
申请人	DISCO CORPORATION	发明人	NANJO, MASATOSHI
分类号	B32B27/08;H01L21/00;H01L21/301;H01L21/68;(IPC1-7):H01L21/304;H01L21/784;B32B7/02;B32B7/06;B32B7/12;B32B35/00;B32B27/32;B32B27/36;B28D5/00	主分类号	B32B27/08
代理机构		代理人
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