Component cooling in electronic devices

摘要

A device for dissipating heat produced by circuitry such as the circuitry associated with an optical transponder includes a plurality of heat dissipating regions. Each heat dissipating region includes a heat sink that is thermally coupled with at least one component. Each heat sink is at least partially thermally isolated from other heat sinks to mitigate heat flow from high-power components to heat sensitive components. Further, all of the heat sinks associated with the circuit package are electrically coupled to provide electromagnetic shielding. A thermally insulative and electrically conductive gasket is employed to couple adjacent heat sinks.