| 摘要 |
The invention relates to a ceramic substrate (1) consisting of a multilayered structure, comprising electric interconnections and integrated components, characterized in that it also comprises at least one cavity (2) filled with a conductive deposit (3) on at least one portion of the depth thereof, said conductive deposit consisting of a heat sink for receiving a power component. Advantageously, the conductive deposit is electrolytically obtained at low cost in a collective manner. The invention also relates to a module integrating a power component at conductive-deposit level, in addition to the electronic circuit wherein the module is associated with a printed circuit. |
