发明名称 EPOXY RESIN COMPOSITION, ITS PRE-CURED PRODUCT AND CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition which provides a low dielectric loss tangent of≤3×10<SP>-3</SP>, even at a high frequency of 1 GHz; provides a rapid cure rate and has an excellent shelf stability, its pre-cured product and a cured product. SOLUTION: The epoxy resin composition essentially comprises an epoxy resin, an active ester compound and a hardening accelerator, wherein the hardening accelerator comprises an imidazole compound and a tertiary amine compound. Here, the total content of the imidazole compound and the tertiary amine compound is 0.2-1.5 pts.mass against 100 pts.mass (A) epoxy resin, and the content of the tertiary amine compound is 0.1-0.3 pts.mass. The pre-cured product and the cured product are prepared from this composition. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003261650(A) 申请公布日期 2003.09.19
申请号 JP20020061884 申请日期 2002.03.07
申请人 DAINIPPON INK & CHEM INC 发明人 FUJIMOTO KOICHI;USAMI SUKEAKI;DEMURA SATOSHI;MAEKAWA FUMIHIKO
分类号 C08J5/24;C08G59/56;(IPC1-7):C08G59/56 主分类号 C08J5/24
代理机构 代理人
主权项
地址