发明名称 CONDUCTIVE PASTE AND CHIP-TYPE ELECTRONIC COMPONENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste which is improved in adhesive strength of a coating film, formed after the paste is applied and dried and can make an external electrode small and uniform in thickness, and a chip-type electronic component using the paste. SOLUTION: The paste includes a metal powder, a organic resin made of methyl methacrylate polymer and an alcohol containing an aromatic hydrocarbon. The aromatic alcohol is a benzyl alcohol, and an average molecular weight of the methyl methacrylate polymer is in the range of 10,000 to 700,000. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003263922(A) 申请公布日期 2003.09.19
申请号 JP20020062724 申请日期 2002.03.07
申请人 KYOCERA CORP 发明人 HARADA KAZUHIKO
分类号 H01G4/12;H01B1/22;H01G4/30;(IPC1-7):H01B1/22 主分类号 H01G4/12
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