MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND RESIST FLAKING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device and a resist flaking device for solving the problem of damage to an active layer of TFT made up of a silicon-based semiconductor film in a manufacturing process, in which a resist flaking solution becomes strong alkali by its hygroscopic action and corrodes the silicon-based semiconductor film.

SOLUTION: The manufacturing method of the semiconductor device includes a first step of forming a silicon-based semiconductor film on the surface of a substrate, a second step of carrying out etching with a mask of a resist pattern, and a third step of forming a protecting film on the exposed face of the silicon-based semiconductor film as a pre-treatment process, and flaking the resist pattern with the resist flaking solution. In addition, the resist flaking device having a protective film forming means is applied to the manufacturing method to solve the problem.

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