| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress display irregularities by reducing remaining stress due to an anisotropic conductive film formed between a base board and a drive circuit chip. <P>SOLUTION: An input bump I-BUMP for connecting the bottom of the drive circuit chip mounted on a substrate of a display panel to an input wire through the anisotropic conductive film, an output bump O-BUMP for connecting the bottom of the chip to a lead wire from a display area AR of the display panel and a dummy bump D-BUMP are formed and the adhesive face dividing structure EM of the anisotropic conductive film is formed on a part of the uppermost surface of the bottom of the chip. <P>COPYRIGHT: (C)2003,JPO</p> |
