SEMICONDUCTOR CHIP MOUNTING SUBSTRATE, SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND SEMICONDUCTOR DEVICE MOUNTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor chip mounting substrate which enables high-density mounting. SOLUTION: The semiconductor chip mounting substrate 1 includes a semiconductor chip mount 2 for mounting a semiconductor chip 3 on its upper surface, a plurality of upper surface connection terminals 5 provided on the periphery of the upper surface of the semiconductor chip mount, and lower surface connection terminals 4 connected to the upper surface connection terminals via wiring 17 in through-holes 16 and provided on the lower surface thereof. COPYRIGHT: (C)2003,JPO