摘要 |
<p>A solid or semi-solid thermoplastic adhesive (7) adhered to a surface mount electronic device (1); an assembly made of at least a printed circuit board (2), a surface mount electronic device (1), solder joints (5) providing a connection between the printed circuit board (2) and the device (1), and solid thermoplastic adhesive joints attached to the device (1) and the board (2). The thermoplastic adhesive (7) is at least softened and applied to any available surface on the connecting substrate (3) of the surface mounted electronic device (1), and heated to a temperature sufficient to provide an adhesive joint between the organic surface and the board (2). There is also provided an assembly having a surface mounted electronic device (1) mounted onto a printed circuit board (2) and a thermoplastic adhesive (7) applied to the surface mounted electronic device (1) facing the printed circuit board (2) and providing for a gap between the thermoplastic adhesive (7) and the printed circuit board (2). The assembly is heated to at least soften the thermoplastic adhesive (7) sufficiently to flow across the gap and provide a thermoplastic adhesive joint between the surface mounted electronic device (1) and the printed circuit board (2). There is further provided a thermoplastic adhesive composition having at least (A) from 5 % to 98 % by weight of a functionalized polyolefin, and (B) from 2 % to 95 % by weight of a polyamide compound.</p> |