发明名称 Cooling structure for electronic circuit unit
摘要 A cooling structure for separating a cooling air which is forced to pass an electronic unit in a horizontal direction. The electronic circuit unit is attached in a subunit of a communication device. The cooling structure includes a separation member for separating an intake air and a discharge air into a front area and a back area. This separation member is provided at an upper side or a lower side of the subunit, and extends from one side to the other side of the subunit.
申请公布号 US2003174466(A1) 申请公布日期 2003.09.18
申请号 US20020272957 申请日期 2002.10.17
申请人 HIKAWA KOJI 发明人 HIKAWA KOJI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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