| 摘要 |
<p>A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer at a temperature from 50°C to 120°C to etch the liquid crystal polymer substrate. An adherent metal layer may be deposited on the etched liquid crystal polymer substrate using either electroless metal plating or vacuum deposition of metal. When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer, followed by application of a palladium(II) solution, provides the metal-seeded liquid crystal polymer. Etchant solutions may be used to form flexible circuits comprising a liquid crystal polymer film, having through-holes and related shaped voids, and for surface preparation of liquid crystal polymer substrates applied to flexures for hard disk drives.</p> |
