| 摘要 |
<p>The present invention relates to a photonic device including a first device comprising a first set of layers, including at least a first waveguide layer, arranged in a mesa structure, and a second set of layers, including at least a second waveguide layer, formed in a second device region coupled to said first device in a light transmission direction. A cladding layer is arranged on top of the mesa structure, the second device region and the surrounding semiconductor material. A contact layer is arranged on top of the cladding layer, and a first and a second metal contact is arranged on top of the contact layer. The first set of layers, the cladding and contact layers are shaped in etching processes to remove adjacent arranged material. An insulating material is applied around the not etched cladding and contact layer. The invention also relates to a manufacturing method.</p> |
