发明名称 Evaporation of Y-Si-O films for medium-k dielectrics
摘要 A gate oxide and method of fabricating a gate oxide that produces a more reliable and thinner equivalent oxide thickness than conventional SiO2 gate oxides are provided. Gate oxides formed from yttrium, silicon, and oxygen are thermodynamically stable such that the gate oxides formed will have minimal reactions with a silicon substrate or other structures during any later high temperature processing stages. The process shown is performed at lower temperatures than the prior art, which inhibits unwanted species migration and unwanted reactions with the silicon substrate or other structures. Using a thermal evaporation technique to deposit the layer to be oxidized, the underlying substrate surface smoothness is preserved, thus providing improved and more consistent electrical properties in the resulting gate oxide.
申请公布号 US2003176040(A1) 申请公布日期 2003.09.18
申请号 US20020099194 申请日期 2002.03.13
申请人 MICRON TECHNOLOGY, INC. 发明人 AHN KIE Y.;FORBES LEONARD
分类号 H01L21/28;H01L21/316;H01L29/51;(IPC1-7):H01L21/823;H01L21/336 主分类号 H01L21/28
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