Interconnect bus crossover for MEMS

摘要

A shielded interconnect bus crossover useful in interconnecting MEM devices with control signal sources or the like and a method of fabricating such a shielded interconnect bus crossover are disclosed. In one embodiment, a shielded interconnect bus crossover (10) includes a plurality of base pads (44A-C) and a plurality of support columns (74) extending upward from the base pads (44A-C) through holes formed in an interconnect bus shield (78) overlying a plurality of interconnect bus lines (42). The support columns (74) support a two layer elevated crossing line (92/112) in a spaced relation above the interconnect bus shield (78). The two layer elevated crossing line (92/112) is oriented transverse to the direction of the interconnect bus lines (42) and is located within the perimeter of a two layer rectangular crossing line shield wall (96/116).