发明名称 POSITIVE RESIST COMPOSITION
摘要 A positive resist composition comprising (a) a resin that is decomposed by the action of an acid to increase solubility in an alkali developing solution, contains a structural unit having a group represented by formula (X) defined in the specification, has a weight average molecular weight of not more than 5,000, and contains an acid decomposable group in an amount of not more than 40% based on the sum total of a number of the acid decomposable group and a number of an alkali-soluble group not protected with the acid decomposable group, and (b) a compound that generates an acid upon irradiation of an actinic ray or radiation.
申请公布号 US2008096130(A1) 申请公布日期 2008.04.24
申请号 US20070926479 申请日期 2007.10.29
申请人 FUJIFILM CORPORATION 发明人 SHIRAKAWA KOJI;FUJIMORI TORU;YASUNAMI SHOICHIRO
分类号 G03C1/73;G03F7/039;H01L21/027 主分类号 G03C1/73
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