SEMICONDUCTOR PACKAGE MODULE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package module, capable of surely carrying out connection between a package substrate and semiconductor chips, even if stress is exerted, when packaging the semiconductor chips.

SOLUTION: The semiconductor package module is constructed so that the other surface of the package substrate 11 for packaging the semiconductor chips 12 is made into a flat surface by embedding an electrode 15 connecting with the chip-like electronic element 14.

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