| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce costs by simplifying manufacturing processes and shortening processing time, and readily and surely realize improvement in transmission characteristics by preventing breakage of wiring, in a semiconductor device in which semiconductor chips are stacked. <P>SOLUTION: A semiconductor package, in which a second semiconductor chip 12 is mounted on a first semiconductor chip 18, is manufactured by plating a group of wirings 16 extending over the first semiconductor chip 18, from a single plated film through a continuous single process, while bonding the first semiconductor chip 18 with the second semiconductor chip 12. <P>COPYRIGHT: (C)2003,JPO |
