| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which a layer to be released is laminated on a base having a curvature, and to particularly provide a method for forming a light emitting unit having an OLED laminated on a display having a curvature or more particularly a base having a curvature. SOLUTION: The method for manufacturing the semiconductor device comprises the steps of applying an external force to a support originally having curvature and elasticity, and adhering the support to the layer to be released formed on the board. When the board is thereafter released, the support is returned to an original shape by a restoring force, and the layer is curved along the shape of the support. Finally, when a transfer material originally having curvature is adhered to the layer, a device having a desired curvature is completed. COPYRIGHT: (C)2003,JPO
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