| 发明名称 |
Methods of making microelectronic assemblies including folded substrates |
| 摘要 |
A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically. |
| 申请公布号 |
US2003168725(A1) |
申请公布日期 |
2003.09.11 |
| 申请号 |
US20020281550 |
申请日期 |
2002.10.28 |
| 申请人 |
TESSERA, INC. |
发明人 |
WARNER MICHAEL;DAMBERG PHILIP;RILEY JOHN B.;GIBSON DAVID;KIM YOUNG-GON;HABA BELGACEM;SOLBERG VERNON |
| 分类号 |
H01L23/538;H01L25/065;H05K1/18;(IPC1-7):H05K1/14 |
主分类号 |
H01L23/538 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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