发明名称 |
Heat treatment apparatus and a method for fabricating substrates |
摘要 |
A heat treatment apparatus for performing a heat treatment on one or more substrates includes a substrate support device holding the substrates, the substrate support device having a main body and a contact portion being in contact with a substrate. A surface of the main body is made of a material different from that of the contact portion, and at least a surface of the contact portion is made of either glassy carbon or graphite.
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申请公布号 |
US2003170583(A1) |
申请公布日期 |
2003.09.11 |
申请号 |
US20030373754 |
申请日期 |
2003.02.27 |
申请人 |
HITACHI INT ELECTRIC INC |
发明人 |
NAKASHIMA SADAO;SHIMADA TOMOHARU;ISHIGURO KENICHI |
分类号 |
C30B33/00;H01L21/673;(IPC1-7):H01L21/477;H01L21/324;H01L21/42;H01L21/26;F27D3/12;F27D1/00;F27D5/00 |
主分类号 |
C30B33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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