发明名称 Heat treatment apparatus and a method for fabricating substrates
摘要 A heat treatment apparatus for performing a heat treatment on one or more substrates includes a substrate support device holding the substrates, the substrate support device having a main body and a contact portion being in contact with a substrate. A surface of the main body is made of a material different from that of the contact portion, and at least a surface of the contact portion is made of either glassy carbon or graphite.
申请公布号 US2003170583(A1) 申请公布日期 2003.09.11
申请号 US20030373754 申请日期 2003.02.27
申请人 HITACHI INT ELECTRIC INC 发明人 NAKASHIMA SADAO;SHIMADA TOMOHARU;ISHIGURO KENICHI
分类号 C30B33/00;H01L21/673;(IPC1-7):H01L21/477;H01L21/324;H01L21/42;H01L21/26;F27D3/12;F27D1/00;F27D5/00 主分类号 C30B33/00
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