| 摘要 |
After electrically connecting first interconnecting lines respectively to a first group of electrodes of an integrated circuit chip, second interconnecting lines are electrically connected to a second group of electrodes of the integrated circuit chip, respectively. The pitch of the first group of electrodes is wider than that of the second group of electrodes. A first support member has a larger rate of deformation due to at least one of heat and humidity than a second support member.
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