发明名称 |
Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method |
摘要 |
An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value.
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申请公布号 |
US2003168496(A1) |
申请公布日期 |
2003.09.11 |
申请号 |
US20030385727 |
申请日期 |
2003.03.11 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
SHINKAI MASAYUKI;KIDA MASAHIRO |
分类号 |
B23K35/00;B23K1/19;B23K35/02;B23K35/14;B23K35/24;B23K35/28;B23K35/32;B23K103/18;C04B37/02;C09J1/00;(IPC1-7):B23K31/00 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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