发明名称 |
Multi-layer printed circuit board and a BGA semiconductor package using the multi-layer printed circuit board |
摘要 |
A multi-layer printed circuit board on which insulation resin layers and circuit pattern layers are alternatively stacked to form multiple layers, including: an insulation resin layer; a circuit pattern formed at the upper surface of the insulation resin layer; a blind via hole formed penetrating the insulation resin layer and the circuit pattern; a plated layer formed at the upper surface of the circuit pattern, at the inner wall face and the bottom of the blind via hole; an inner lead bump pad formed at the surface of the plated layer which is exposed to the lower surface of the insulation resin layer; and an outer lead bump pad formed on the circuit pattern which is formed at the upper surface of the insulation resin layer, whereby the problem of defective attachment of a bump due to a void present in a blind via hole is eliminated.
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申请公布号 |
US2003168255(A1) |
申请公布日期 |
2003.09.11 |
申请号 |
US20030384658 |
申请日期 |
2003.03.11 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
KIM DOCK-HEUNG;KIM YONG-IL |
分类号 |
H05K3/46;H01L23/12;H05K1/11;H05K3/00;H05K3/28;(IPC1-7):H05K1/11;H01R12/04 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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