发明名称 Wiring board and method for producing the same
摘要 A wiring board comprising: a metal core substrate shaped like a rectangle in plan view and having a front surface and a rear surface; and a buildup layer comprising an electrically insulating layer and a wiring layer, the buildup layer being formed on the front surface or the rear surface of the metal core substrate, wherein the metal core substrate has an extension formed on its side surface.
申请公布号 US2003168249(A1) 申请公布日期 2003.09.11
申请号 US20030365438 申请日期 2003.02.13
申请人 NGK SPARK PLUG CO., LTD. 发明人 ITO TATSUYA;KIMURA YUKIHIRO
分类号 H05K3/00;H05K3/44;H05K3/46;(IPC1-7):H05K7/06 主分类号 H05K3/00
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