| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for sealing of a photosemiconductor excellent especially in transparency to a low wavelength ray, deterioration resistance to ultraviolet ray, thermal resistance and fluidity and to provide a photosemiconductor apparatus. SOLUTION: The thermosetting resin composition for sealing of a photosemiconductor comprises: (A) an unsaturated polyester resin obtained from an alicyclic polyhydric alcohol and/or an aliphatic polydric alcohol and an unsaturated polybasic acid and/or its anhydride; (B) a triallyl isocyanurate; and (C) an organic peroxide, wherein the unsaturated polyester resin contains anα,β-ethylenically unsaturated group derived from the unsaturated polybasic acid component of not less than 1 mol/kg weight, has phototransmittance of not less than 90% in 1 mm light pass length within a region of wavelength 380-400 nm, and has a softening point of not less than 50°C to less than 120°C, and this composition is used for a photosemiconductor apparatus. COPYRIGHT: (C)2003,JPO
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