| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high flame retardancy and reliability of reflowing resistance and a semiconductor device sealed with it. SOLUTION: The composition contains (A) an epoxy resin, (B) a hardening agent, (C) a filler and (D) a flame retardant, and (B) contains a phenol compound having repeated structural units of formula (I) (wherein R<SP>1</SP>-R<SP>4</SP>are each a hydrogen atom or a methyl group) and those of formula (II) (wherein R<SP>5</SP>-R<SP>8</SP>are each a hydrogen atom or a methyl group). Preferably, (D) consists of one or more of (d1) organic phosphorus compounds, (d2) red phosphorus and (d3) metal hydroxides. COPYRIGHT: (C)2003,JPO
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