| 摘要 |
PROBLEM TO BE SOLVED: To obtain a sealing resin composition for outer packaging capable of being low pressure transfer-molded and giving a cured item showing excellent impact resistance from outside and to provide an electronic part device produced by using the sealing resin composition for outer packaging. SOLUTION: The sealing resin composition for outer packaging contains a linear chain epoxy resin (A) having an epoxy group at each end, a phenol resin (B) and an inorganic filler (C) as essential components wherein the linear chain epoxy resin (A) having the epoxy group at the each end is mainly composed of a bisphenol A type epoxy resin having an epoxy equivalent of not less than 200, the inorganic filler (C) is mainly composed of silica powder and the content of the inorganic filler (C) is 40 to 90 wt.% based on the whole resin composition. COPYRIGHT: (C)2003,JPO
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