| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin material having non-halogen and non- antimony and showing good flame retardance without damaging reliability in properties such as moldability, reflow resistance, humidity resistance, storage stability at a high temperature, and to provide an electronic part device equipped with an element sealed with the epoxy resin material. SOLUTION: The epoxy resin molding material for sealing containing an epoxy resin (A), a curing agent (B) and a composite metal hydroxide as essential components is characterized in that, when the crashed pieces of a molded item of the material are extracted with water whose amount is 10 ml per 1 g of the pieces at 121°C under pressure of 2 atmospheres, the extracting water has a sodium ion (Na<SP>+</SP>) content of no more than 3 ppm and a chlorine ion (Cl<SP>-</SP>) content of not more than 3 ppm and shows electric conductivity of not more than 100μS/cm and pH of 5.0 to 9.0. COPYRIGHT: (C)2003,JPO |
