SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor package structure of the present invention may include a mold member which is embedded with a first semiconductor die arranged so that a first die pad face an upper end, a downward redistribution layer which is connected to the first die pad, a penetration via which connects the wiring pad of the redistribution layer and a bond finger on the mold member, a second semiconductor die attached to the mold member, a wire which connects the second die pad of the second semiconductor die and the bond finger, and a metal lead which is attached onto the mold member while surrounding the second semiconductor die and the wire. So, the semiconductor die can be easily attached.