发明名称 WIRING BOARD FOR MULTIPLE UNITS
摘要 PROBLEM TO BE SOLVED: To provide a wiring board for multiple units, to which electrical check can be efficiently executed in a state of arranging respective wiring board areas in a ceramic base substrate. SOLUTION: In the wiring board constituted of integrally arraying many approximately rectangular wiring board areas 2, each of which forms electronic component connecting metallized pads 5 to be connected to electrodes of electronic components on the upper surface and forms external connection metallized pads 6 to be connected to wiring conductors of an external electric circuit board on the outer periphery of the lower surface, in the ceramic base substrate 1 in the vertical and horizontal directions and making through-holes 4 constituted of sticking external connection metallized layers 8 to be connected to the wiring conductors of the external electric circuit board to their inner walls on respective boundary lines 3 partitioning respective wiring substrate regions 2, the pads 5 are electrically connected to the pads 6 so as to be electrically independent of the layers 8. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003249589(A) 申请公布日期 2003.09.05
申请号 JP20020048669 申请日期 2002.02.25
申请人 KYOCERA CORP 发明人 NAKAMOTO KOTARO
分类号 H05K1/02;H01L23/12;H05K3/00 主分类号 H05K1/02
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