发明名称 METHOD AND DEVICE FOR SURFACE TREATMENT
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment method and a surface treatment device which can remove an attaching substance in a base surface without using wet- type process by low temperature treatment alone. SOLUTION: In a surface treatment method for removing an attaching substance in a base surface Ws, after a washing gas G is supplied to the base surface Ws under light irradiation such as ultraviolet ray, rinse treatment is carried out by supplying supercritical fluid consisting of a supercritical substance L<SB>1</SB>to the base surface Ws. Carbon dioxide is preferably used for the supercritical fluid. Furthermore, a melting auxiliary agent L<SB>2</SB>for melting compound of an element of the washing gas G activated by light irradiation and an attaching substance is added to the supercritical fluid. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003249475(A) 申请公布日期 2003.09.05
申请号 JP20020047473 申请日期 2002.02.25
申请人 SONY CORP 发明人 SAGA KOICHIRO
分类号 G02F1/13;B08B3/10;B08B5/02;B08B7/00;C23F1/00;C23F1/12;G02F1/1333;H01L21/304;(IPC1-7):H01L21/304;G02F1/133 主分类号 G02F1/13
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