| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a manufacturing cost by miniaturizing a ceramics substrate while a terminal of a semiconductor element is easily soldered. <P>SOLUTION: A ceramics substrate 2 is jointed to a surface of a base plate 1 while an MOSFET 4 is mounted on the surface of the ceramics substrate 2. An insulating board 6 is so provided on the surface of the base plate 1 as to adjoin the ceramics substrate 2, while metal wirings 6A and 6B are formed on the surface of insulating board 6. A drain terminal D and a source terminal S of the MOSFET 4 are connected to the metal wirings 6A and 6B, respectively, and a bus bar electrode 8 is connected to the metal wiring 6A. Thus, a metal wiring can be omitted from the ceramics substrate 2 for miniaturization while the metal wirings 6A and 6B can be formed on the insulating board 6 of high heat resistance, and the terminal of MOSFET 4 is easily soldered to the metal wirings 6A and 6B. <P>COPYRIGHT: (C)2003,JPO |
