发明名称 |
EXPOSURE MASK, METHOD OF MANUFACTURING EXPOSURE MASK, AND EXPOSURE METHOD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an exposure mask capable of decreasing the defects on a wafer occurring in the defects on the mask, a method of manufacturing the exposure mask and an exposure method. <P>SOLUTION: The exposure mask is provided with a design pattern 3 which forms an actual device and a monitor pattern which possesses a defect having the smallest defect size exceeding a permissible range and further a defect detectable by a defect inspection apparatus and having the defect size within the permissible range together with the design pattern. The defect inspection of the design pattern 3 and the defect inspection of the monitor pattern 5 are performed by using the defect inspection apparatus and after the defect of the monitor pattern 5 is confirmed to be detectable by the defect inspection apparatus, the defect of the design pattern 3 detected in the defect inspection is corrected. <P>COPYRIGHT: (C)2003,JPO</p> |
申请公布号 |
JP2003248295(A) |
申请公布日期 |
2003.09.05 |
申请号 |
JP20020050891 |
申请日期 |
2002.02.27 |
申请人 |
SONY CORP |
发明人 |
OGURA AKIHIRO;GUNJI TAKEHIKO |
分类号 |
G03F1/68;G03F1/72;G03F1/84;G03F7/20;H01L21/027;(IPC1-7):G03F1/08 |
主分类号 |
G03F1/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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